- Micro-component & thin board carrier
- Flow soldering carrier
Omni-use micro-component & thin board transfer
Please consult us regarding the products other than the adhesive type.
- Up to 1,000 times * repeated use
- Readily peelable after reflow
- Chemical resistance (washable with IPA, water-based and neutral detergent)
- Part-defined adhesion (flat/indented surfaces)
- Supports large format size (600 × 500 mm)
- Three adhesive types (weak, strong, ultra-strong)
Adhesive strength can be adjusted upon request
- Three patents registered.
No. 4571436, No. 4695349, No. 4695350
* According to our reflow evaluation test.
Easy to Peel